The FleepTech concept
Our technology implements the intelligent core of flexible electronic applications, by enabling the integration and driving of conformable organic sensors, actuators and power sources.
Realized with complementary organic technology, FleepIC features mechanical flexibility and electronic operation with low power consumption, while easy, cost- and energy-efficient manufacturing is guaranteed by manufacturing processes derived from printing.
How we do our magic
WE TRANSFORM SPECIALTY CARBON-BASED MATERIALS INTO INKS
STEP 1
WE CUSTOMLY DESIGN MICROCHIPS WITH OUR COMPONENT LIBRARY
STEP 2
WE INTEGRATE PRINTED EXTERNAL COMPONENTS
STEP 3
WE PRINT COMPLEX INTEGRATED SYSTEMS WITH STANDARD EQUIPMENT
STEP 4
New Electronics - Unprecedented Capabilities
FLEXIBLE AND ULTRA-THIN
As thin as 1um our circuits can fit on substrate as thin as 1/100th of a human hair, enabling flexibility and conformability to any surface with non-conventional form factors.
RECYCLABLE
When our intelligent systems reach their end of life they do not constitute special waste, and can be recycled easily as plastic.
LARGE-AREA: FOR INTELLIGENT SURFACES
The use of coating and printing technologies allows integration of electronic functionality on large areas and roll-to-roll production lines.
