The FleepTech concept

Our technology implements the intelligent core of flexible electronic applications, by enabling the integration and driving of conformable organic sensors, actuators and power sources.
Realized with complementary organic technology, FleepIC features mechanical flexibility and electronic operation with low power consumption, while easy, cost- and energy-efficient manufacturing is guaranteed by manufacturing processes derived from printing.

How we do our magic

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    WE TRANSFORM SPECIALTY CARBON-BASED MATERIALS INTO INKS

STEP 1

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    WE CUSTOMLY DESIGN MICROCHIPS WITH OUR COMPONENT LIBRARY

STEP 2

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    WE INTEGRATE PRINTED EXTERNAL COMPONENTS

STEP 3

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    WE PRINT COMPLEX INTEGRATED SYSTEMS WITH STANDARD EQUIPMENT

STEP 4

New Electronics - Unprecedented Capabilities

FLEXIBLE AND ULTRA-THIN

As thin as 1um our circuits can fit on substrate as thin as 1/100th of a human hair, enabling flexibility and conformability to any surface with non-conventional form factors.

RECYCLABLE

When our intelligent systems reach their end of life they do not constitute special waste, and can be recycled easily as plastic.

LARGE-AREA: FOR INTELLIGENT SURFACES

The use of coating and printing technologies allows integration of electronic functionality on large areas and roll-to-roll production lines.

NO ASSEMBLY

Every component of our integrated systems is printed, from ICs to sensors, actuators and energy supplies. This avoids the expensive step of assembling multiple external components.