Our technology implements the intelligent core of flexible electronic applications, by enabling the integration and driving of conformable organic sensors, actuators and power sources.
Realized with complementary organic technology, FleepIC features mechanical flexibility and electronic operation with low power consumption, while easy, cost- and energy-efficient manufacturing is guaranteed by manufacturing processes derived from printing.
How we do our magic
WE TRANSFORM SPECIALTY CARBON-BASED MATERIALS INTO INKS
WE CUSTOMLY DESIGN MICROCHIPS WITH OUR COMPONENT LIBRARY
WE INTEGRATE PRINTED EXTERNAL COMPONENTS
WE PRINT COMPLEX INTEGRATED SYSTEMS WITH STANDARD EQUIPMENT
New Electronics - Unprecedented Capabilities
FLEXIBLE AND ULTRA-THIN
As thin as 1um our circuits can fit on substrate as thin as 1/100th of a human hair, enabling flexibility and conformability to any surface with non-conventional form factors.
When our intelligent systems reach their end of life they do not constitute special waste, and can be recycled easily as plastic.
LARGE-AREA: FOR INTELLIGENT SURFACES
The use of coating and printing technologies allows integration of electronic functionality on large areas and roll-to-roll production lines.
Every component of our integrated systems is printed, from ICs to sensors, actuators and energy supplies. This avoids the expensive step of assembling multiple external components.